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Haze and lack of clarity are considered among the most vexing and stubborn of defects in the assembly of LCD screens and surfaces. Significant advances have been made in the optical quality and capability of liquid crystals and LEDs; however, these advances can be stunted by choices made further along in the assembly process. Specifically, liquid optically clear adhesives (LOCAs) used in the bonding of assembly layers can cause haze and light refraction either immediately or under certain aging conditions. The proper design of LOCA materials must take this risk of haze development into consideration. There are a number of effective approaches to minimizing or eliminating haze.

Liquid optically clear adhesives (LOCA) provide superior optical enhancement and anti-glare properties in the manufacture of liquid crystal displays. Light, temperature and moisture can significantly affect the physical and optical properties of these adhesives, promoting yellowing or discoloration, delamination, and loss of adhesion. In this discussion, we will explain the use of “accelerated weathering exposure” in the design of LOCA and its advantages over more traditional individual factor analysis.

While conformal coatings increase the lifetime of electronic devices by providing a thin barrier that strengthens their ability to withstand harsh environmental conditions, adhesives and encapsulants provide a significantly higher level of protection on the entire assembly.

The most common properties of adhesives and encapsulants include:

• creating environmental seals that protect against moisture and corrosion,
• providing high-temperature resistance,
• increasing shock and vibration dampening,
• generating strong bonds to a variety of substrates,
• maintaining low shrinkage, and
• offering thermal conductivity.

Consisting of a resin and a hardener, a two-component epoxy can be formulated to offer a wide range of mechanical, thermal and electrical properties. While mix ratios differ, they all offer the ability to cure at ambient temperatures or elevated temperatures for faster cures. Here are a few tips to help you mix and apply your two-part epoxy.

Electronics continue to be placed into harsher environments, and PCB component vibration dampening remains a challenge for many industries. When the solder connection strength is not going to be sufficient to withstand years of vibration, there is a solution: staking materials.

Numerous fields of industry manufacture products that are prone to high-vibration environments. Some of them are: