Blog

While conformal coatings increase the lifetime of electronic devices by providing a thin barrier that strengthens their ability to withstand harsh environmental conditions, adhesives and encapsulants provide a significantly higher level of protection on the entire assembly.

The most common properties of adhesives and encapsulants include:

• creating environmental seals that protect against moisture and corrosion,
• providing high-temperature resistance,
• increasing shock and vibration dampening,
• generating strong bonds to a variety of substrates,
• maintaining low shrinkage, and
• offering thermal conductivity.

Encapsulant solutions are commonly used to enhance protection of circuit boards from environmental and liquid contaminants, chemical attack, and electrical shortages. While potting materials provide many positive attributes when used to protect PCBs, sometimes other issues arise during and post application of these compounds. This blog focuses on “bubbles” forming within the encapsulant itself.