While conformal coatings increase the lifetime of electronic devices by providing a thin barrier that strengthens their ability to withstand harsh environmental conditions, adhesives and encapsulants provide a significantly higher level of protection on the entire assembly.
The most common properties of adhesives and encapsulants include:
- creating environmental seals that protect against moisture and corrosion,
- providing high-temperature resistance,
- increasing shock and vibration dampening,
- generating strong bonds to a variety of substrates,
- maintaining low shrinkage, and
- offering thermal conductivity.
HumiSeal adhesives and encapsulants are available as 1K or 2K compounds with medium to high viscosity. They can be used in the following processes:
- A- bonding/staking
Used for the purpose of joining or securing a component in order to increase shock and vibration resistance by releasing the strain from the solder joints.
Also read: How Best to Protect PCB Mounted Components from Vibration
- B- potting or casting
Involves a case filled with liquid potting material to completely cover the device and the components. In casting, a temporary frame is used.
Also read: 5 Simple Steps to Eliminate Bubbles in Potting Encapsulants
- C- encapsulation/dam and fill
Utilized to enclose, without the use of a case or frame, small areas of the assembly to address critical components that require a high level of protection.
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Pros and Cons of Different Encapsulation and Adhesive Application Methods
The following offers a wide range of application methods, such as
1. Manual application with 1- or 2-part dispensing guns advantages
disadvantages
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2. Semi-automated dispensing systems for 1- or 2-part materials advantages
disadvantage
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Also read: 4 Tips to Successfully Apply Two-Component Epoxy Adhesives
3. Automated benchtop robots advantages
disadvantages
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4. Fully automated dispensing systems advantages
disadvantage
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HumiSeal’s wide range of adhesives and encapsulants allows you to increase the level of protection of the entire assembly or specific components, regardless of the application method chosen.
If you have questions, you can always contact us.
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