While conformal coatings increase the lifetime of electronic devices by providing a thin barrier that strengthens their ability to withstand harsh environmental conditions, adhesives and encapsulants provide a significantly higher level of protection on the entire assembly.
- creating environmental seals that protect against moisture and corrosion,
- providing high-temperature resistance,
- increasing shock and vibration dampening,
- generating strong bonds to a variety of substrates,
- maintaining low shrinkage, and
- offering thermal conductivity.
- A- bonding/staking
Used for the purpose of joining or securing a component in order to increase shock and vibration resistance by releasing the strain from the solder joints.
- B- potting or casting
Involves a case filled with liquid potting material to completely cover the device and the components. In casting, a temporary frame is used.
- C- encapsulation/dam and fill
Utilized to enclose, without the use of a case or frame, small areas of the assembly to address critical components that require a high level of protection.
Pros and Cons of Different Encapsulation and Adhesive Application Methods
The following offers a wide range of application methods, such as
1. Manual application with 1- or 2-part dispensing guns
|2. Semi-automated dispensing systems for 1- or 2-part materials
3. Automated benchtop robots
|4. Fully automated dispensing systems
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