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5 Simple Steps to Eliminate Bubbles in Potting Encapsulants

Encapsulant solutions are commonly used to enhance protection of circuit boards from environmental and liquid contaminants, chemical attack, and electrical shortages. While potting materials provide many positive attributes when used to protect PCBs, sometimes other issues arise during and post application of these compounds. This blog focuses on “bubbles” forming within the encapsulant itself.

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Tired of Masking?  Try Selective Dip Coating

When conventional coating methods such as hand spray, total dipping or robotic selective coating don’t provide the protection required, there is always selective dip coating.

What is selective dip conformal coating?

Selective dip coating is a process whereby the substrate rather than globally immerised in the coating, is discreetly coated in desired locales.  The technique in one form or...

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Simple Steps to Ensure Proper Wetting & Good Adhesion

Have you ever seen your conformal coating separate or de-wet?  Have you observed the conformal coating to flake off after cure? The key to your success is understanding the relationship between surface energy (of the substrate) and surface tension (of the conformal coating).  There are some simple steps you can take to help ensure you possess a healthy balance of both.

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3 Simple Ways to Remove HumiSeal UV Conformal Coatings

This blog post outlines the techniques required for the removal of HumiSeal UV cure conformal coating. The products covered in this article are:

  • UV40, UV40-250
  • UV50LV
  • UV500, UV500LV

There are 3 methods for the removal of HumiSeal UV conformal coatings:

  1. Mechanical removal: Powder Micro Abrasion
  2. Thermal removal: Burn Through
  3. Chemical removal

All three methods will effectively remove the...

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